ASML and Samsung push 12-inch photomasks to boost AI chip production
ASML and Samsung expanded their partnership to develop 12-inch photomasks for High NA EUV lithography, aiming to increase fab productivity by 40% per ASML's CTO. Samsung plans to use the technology for DRAM production by 2028, while TSMC targets 2030. The move addresses bottlenecks in making larger AI chips.
Bottom line — ASML's 12-inch mask initiative could cut chip costs by 40% per the company, locking in a seven-year roadmap for the world's top chipmakers.
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- Samsung will join ASML's consortium to develop 12-inch photomasks, replacing the 6-inch standard used for decades, per Yonhap.
- The larger masks remove 'stitching constraints' that limit chip size, enabling bigger AI accelerator dies, according to Securities.io.
- ASML CTO Marco Pieters told Reuters the productivity gain from larger masks could reach 40%.
- Samsung plans to introduce High NA EUV into DRAM high-volume manufacturing by 2028, a first for the memory industry, reported Chosun Ilbo.
- TSMC said it will adopt High NA EUV for advanced-node production from 2030, per Reuters.
- Intel is already using High NA EUV for production, having run over a million wafers, according to Startup Fortune citing Tom's Hardware.
- ASML aims for a 12-inch mask pilot line by 2031 and high-volume readiness by 2033, per Reuters.
- SK Hynix is evaluating joining the consortium and also targets 2028 for High NA EUV in DRAM, according to Reuters.
- Each High NA EUV machine costs around €370 million ($400 million), and ASML is the sole supplier, per Startup Fortune.
- ASML raised its 2026 revenue guidance to €43-45 billion amid surging AI chip demand, reported Crypto Briefing.