Apple’s COO inspects Foxconn as iPhone Duo production ramps up
Apple COO Sabih Khan visited Foxconn’s Zhengzhou site on 11 October, five days before pre-orders for the company’s first foldable phone, the iPhone Duo, were due to open, according to Jiemian News. Khan said Apple and Foxconn had developed new manufacturing capabilities for the product and were expanding production while maintaining Apple’s quality standards.
Bottom line — Foxconn says its new SoC shielding process, also used for the iPhone 18 series, reduces module thickness by 20%.
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Jiemian News reports that a customised 3D-printing system scans and refines the iPhone Duo’s hinge components.
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Foxconn’s SoC shielding process replaces traditional metal covers with electromagnetic sputtering applied directly to the chip package, according to Foxconn executive Jiang Jiheng.
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Jiang said the process is intended to improve heat dissipation as well as reduce thickness.
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Jiemian News reports that the SoC sputtering workshop began production in July, following a Foxconn joint venture with a Zhengzhou state-owned platform.